High-Density RJ45 Connectivity Solution for Advanced Networking

Space-efficient dual-deck design with enhanced structural strength for data centers, servers, and telecommunications equipment

Dual-Deck RJ45 Connector for Telecommunications Infrastructure - Dual-Deck RJ45 Connector for Telecommunications Infrastructure
  • Dual-Deck RJ45 Connector for Telecommunications Infrastructure - Dual-Deck RJ45 Connector for Telecommunications Infrastructure

Dual-Deck RJ45 Connector for Telecommunications Infrastructure

J061-4-140220

Double Decker 2X4 port RJ45 Through Hole Unshielded

JCON Dual-Deck RJ45 Connector would enhance telecommunications infrastructure, offering two-tiered connectivity solutions for optimized data transmission in varied settings. On the other hand, we also enhance the structure strength to meet demanding reliability tests.

Introducing the Modular 8P8C Double-Decker JACK Type. This Jack is widely used in Data-Center or even the freshest applications like AI / IoT as well as Servers/Switch. Additionally, it is a precision-engineered connector that redefines versatile and efficient networking. With an unwavering commitment to excellence, this connector embodies our dedication to innovation, quality, and reliability.

Specification

Material:
1. Housing: Engineering Thermoplastic. Thermoplastic UL94V-0.
2. Plating: Gold Plating Over Nickel In Contact. Tin Plating Over Nickel In Solder Area.
3. Contact: Phosphor Bronze.
4. Shielded: Brass With Nickel Plated.

Electrical:
1. Voltage Rating: 125 Vac Rms.
2. Current Rating: 1.5 Amp.
3. Contact Resistance: 40 Milliohms Max.
4. Insulation Resistance: 1000 Megohms Min @500 Vdc.
5. Dielectric Strength: 1000 Vac Rms 60Hz, 1Min.

Mechanical:
1. Operating: 750 Cycles Min.

Environmental:
1. Storage: -40°C To +85°C
2. Operation: - 20°C To +75°C
Mates With Modular Plug Conforming To FCC Part 68, Subpart F.

Key Features
  • Efficient Side Entry Design.
  • Universal 8P8C Compatibility.
  • Robust Construction.
  • Enhanced Signal Integrity.
  • Wide Application Scope.
  • Certified Quality.
Application
  • Network Equipment Manufacturing.
  • Telecommunications Infrastructure.
  • Industrial Automation.
  • IoT (Internet of Things) Devices.
  • Surveillance and Security Systems.
  • Smart Home Applications.
  • Audio-Visual Equipment.
  • Medical Devices.
  • Automotive Electronics.
  • Gaming and Entertainment.
Function Option
Process Type TH
Ports Options N/A
Shielded Options
LED N/A
Grounding N/A
Position and Contact 8P10C, 8P8C, 8P6C, 8P4C, 8P2C, 6P6C, 6P4C, 6P2C
Gold Plating G/F, 6U", 15U", 30U", 50U"
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J061-4-140220
J061-4-140220

RJ45 2X4 port Double Level PCB Unshielded Jack (8P8C)

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What Connector Features Are Critical for Next-Generation AI and IoT Hardware Development?

AI and IoT hardware development requires connectors that balance space efficiency with reliable performance under varying conditions. JCON's Dual-Deck RJ45 Connector delivers this balance with its stacked 2x4 port design that conserves valuable PCB real estate while offering versatile configuration options including multiple position/contact arrangements (8P8C, 8P6C, etc.) and shielding options. With an operating temperature range of -20°C to +75°C and excellent electrical specifications, these connectors provide the foundation for developing robust AI and IoT solutions that can operate reliably in diverse environments from edge computing to data centers.

Built to withstand the rigors of professional networking environments, our Dual-Deck RJ45 Connector offers robust construction with engineering thermoplastic housing (UL94V-0 rated) and superior electrical specifications including 1.5 Amp current rating and 40 milliohms maximum contact resistance. The connector's enhanced structural strength ensures reliable performance through a minimum of 750 operating cycles, while its wide operating temperature range (-20°C to +75°C) makes it suitable for diverse deployment scenarios. Compatible with standard 8P8C modular plugs conforming to FCC Part 68 requirements, this versatile connector provides the perfect balance of high-density connectivity, durability, and performance for next-generation telecommunications and networking applications.